Wiring board, and method for manufacturing same

配線板およびその製造法

Abstract

【課題】基板表面の絶縁性と、配線板の放熱性とを十分に実現する配線板を提供する。 【解決手段】金属基板としてのアルミニウム基板1の表面に金属酸化物絶縁層としてのアルマイト層2が形成され、アルマイト層2のアルミニウム基板1と反対側の表面に熱伝導性樹脂絶縁層3が形成され、熱伝導性樹脂絶縁層3のアルマイト層2と反対側の表面に配線部7が形成されている。そしてアルマイト層2は、その表面に空孔およびクラックの少なくともいずれか一種類の凹部4a、4bを有し、熱伝導性樹脂絶縁層3は、凹部4a、4b内に入り込んだ状態で形成されている。 【選択図】図3
PROBLEM TO BE SOLVED: To provide a wiring board for sufficiently achieving the insulation property of a substrate surface and the radiation property of the wiring board. SOLUTION: An alumite layer 2 as a metal oxide insulating layer is formed on the surface of an aluminum substrate 1 as a metal board, and a heat conductive resin insulating layer 3 is formed on the surface of the alumite layer 2 at the opposite side of the aluminum substrate 1, and a wiring section 7 is formed on the surface of the heat conductive resin insulating layer 3 at the opposite side of the alumite layer 2. Then, the alumite layer 2 is provided with recesses 4a and 4b of at least one type of a hole and a crack on the surface, and the heat conductive resin insulating layer 3 is formed in such a status that it enters the recesses 4a and 4b. COPYRIGHT: (C)2007,JPO&INPIT

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